政大機構典藏-National Chengchi University Institutional Repository(NCCUR):Item 140.119/138997
English  |  正體中文  |  简体中文  |  Post-Print筆數 : 27 |  Items with full text/Total items : 113822/144841 (79%)
Visitors : 51818965      Online Users : 485
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://nccur.lib.nccu.edu.tw/handle/140.119/138997


    Title: 半導體晶圓代工廠商與封測廠商競合關係之探討─以台積電與日月光為例
    Exploring the Co-opetition between Semiconductor Foundry and OSAT: A Case Study of TSMC and ASE
    Authors: 李雯琪
    LEE, WEN-CHI
    Contributors: 吳豐祥
    李雯琪
    LEE, WEN-CHI
    Keywords: 半導體產業
    競合關係
    垂直整合
    互動
    晶圓代工產業
    封測產業
    Semiconductor industry
    Coopetition
    Vertical integration
    Interaction
    Semiconductor foundry
    OSAT company
    Date: 2022
    Issue Date: 2022-02-10 13:21:01 (UTC+8)
    Abstract: 半導體產業為因應終端產品的發展趨勢不斷提升技術能力,隨著摩爾定律逐漸趨緩,晶圓製程持續微縮的困難度日漸升高,因此產業界轉往發展向上堆疊與異質整合等先進封裝技術以延續摩爾定律,先進封裝技術因此被提升到與晶圓製程微縮技術同等重要的位置,更被視為半導體產業未來發展的關鍵,許多半導體業者包括晶圓代工廠、IDM整合元件廠等皆競相加入發展先進封裝,但是隨著晶圓代工廠跨入下游發展先進封裝,雙方一別以往傳統的上下游合作關係,進而演變為了新的競合關係。
    然而在過往半導體產業的相關競合研究中,大多專注在競爭對手之間的競合關係,而今日半導體晶圓代工廠商與封測廠商所形成的競合關係卻是由合作關係下衍生出之競合。此外,過往競合文獻的研究亦大多著重在對於競合關係中參與企業間互動上的探究,而對於單一企業於目標與策略上的轉變及隨之採取的具體作為,可能會如何影響競合關係的形成甚至在日後關係中的競爭力,並沒有太多深入的研究,故為了彌補上述研究缺口,本研究以競合理論的角度出發,選擇晶圓代工與封測龍頭作為深入研究之個案對象,並透過質性研究的深度訪談和次級資料分析的方式,來探討雙方的競合關係成因、發展歷程以及產生的影響,本研究最後所得到的主要結論如下:
    一、半導體晶圓代工廠商與封測廠商會為了實現共同的企業目標而進入合作關係,惟企業目標會隨時間而有動態變化,導致企業產生競爭行為而進入競合關係,其中雙方的合作關係發生在產業鏈上的分工,競爭關係則發生在下游的新技術市場中。
    二、半導體晶圓代工廠商與封測廠商的合作過程中,晶圓代工廠會因受到來自技術瓶頸、客戶需求以及品質控管的競爭壓力而產生競爭行為,並且會藉由提前掌握關鍵技術來增加其跨入競爭關係後的競爭力。惟雙方的技術資源特性會分別影響其各自在競合關係中的優勢。
    三、半導體晶圓代工廠商與封測廠商的競合關係會造成產業分工界線的模糊,惟對於新技術發展與企業營收方面,也會形成正面的影響。
    本論文最後也進一步闡述本研究的學術貢獻,並提出對實務上與後續研究上的建議。
    As the semiconductor industry continues to improve its technical capabilities in response to the development trend of end products, with the gradual slowing of Moore`s Law, the difficulty of continuous shrinking of the wafer process is increasing. To continue Moore`s Law, advanced packaging technology has been promoted to an equally important position as wafer process technology, and is regarded as the key to the future development of the semiconductor industry. Many semiconductor companies, including foundries, IDM companies, etc. are competing to join the advanced packaging field. However, as the foundry has stepped into the downstream to develop advanced packaging technology, the relationship of foundry and OSAT has changed from the traditional upstream and downstream cooperative relationship, and has evolved into a new coopetitive relationship.
    However, in the past research on coopetition in the semiconductor industry, most of them focused on the coopetition between competitors. But nowadays, the coopetition between foundries and OSATs is derived from the cooperation relationship. In addition, most of the previous studies on coopetition have focused on the exploration of the interaction between participating companies in the coopetitive relationship, and there is not much in-depth research on how the changes in the goals and strategies of a single company and the specific actions it takes may affect the formation of the coopetitve relationship. Therefore, in order to make up for the above research gap, this study starts from the perspective of coopetition theory, and selects the semiconductor foundry and OSAT as the case objects for in-depth research. Through qualitative in-depth interviews and secondary data analysis, to explore the causes, development process, and impact of the coopetition between the two parties. The main conclusions of this study are as follows:
    1. Semiconductor foundry and OSAT will enter into cooperative relationships to achieve common corporate goals, but corporate goals will change dynamically over time, leading to competitive behavior and entering a co-opetitive relationship. In the coopetition between the two parties, the cooperation occurs in the division of labor on the industrial chain, and the competition occurs in the downstream new technology market.
    2. During the cooperation of semiconductor foundry and OSAT, the foundry will have competitive behaviors due to the competitive pressure from technical bottlenecks, customer needs, and quality control, and will master key technologies in advance to increase its competitiveness after entering into a competitive relationship. However, the characteristics of the technical resources of both parties will affect their respective advantages in the coopetition.
    3. The coopetition between the semiconductor foundry and the OSAT will result in the vague of industry diversification boundary, but will have a positive impact on new technology development and corporate revenue.
    At the end of this thesis, the academic contribution, practical implications, and follow-up research suggestions of this research are further elaborated.
    Reference: 一、 英文文獻
    Aaker, D. A. (1989). Managing assets and skills: The key to a sustainable competitive advantage. California Management Review 31(2), 91-106.
    Afuah. (2000). How much do your co‐opetitors` capabilities matter in the face of technological change? Strategic Management Journal, 21(3), 397-404.
    Afuah. (2004). Does a focal firm`s technology entry timing depend on the impact of the technology on co-opetitors? Research Policy, 33(8), 1231-1246.
    Anderson, D. S. (1992). Identifying and responding to activist publics: A case study. Journal of Public Relations Research, 4(3), 151-165.
    Bengtsson, M., Eriksson, J., & Wincent, J. (2010). Co‐opetition dynamics – An outline for further inquiry. Competitiveness Review: An International Business Journal, 20(2), 194-214.
    Bengtsson, M., Johansson, M., Näsholm, M., & Raza-Ullah, T. (2013). A systematic review of coopetition: Levels and effects on different levels. Paper presented at the The 13th Annual Conference of the European Academy of Management (EURAM 2013), Istanbul, Turkey, June 26-29, 2013.
    Bengtsson, M., & Kock, S. (1999). Cooperation and competition in relationships between competitors in business networks. Journal of Business & Industrial Marketing, 14(3), 178-194.
    Bengtsson, M., & Kock, S. (2000). "Coopetition" in business networks - To cooperate and compete simultaneously. Industrial Marketing Management, 29(5), 411-426.
    Bengtsson, M., & Kock, S. (2014). Coopetition-Quo vadis? Past accomplishments and future challenges. Industrial Marketing Management, 43(2), 180-188.
    Bengtsson, M., & Raza-Ullah, T. (2016). A systematic review of research on coopetition: Toward a multilevel understanding. Industrial Marketing Management, 57, 23-39.
    Bhagat, S., Bolton, B. J., & Subramanian, A. (2010). CEO education, CEO turnover, and firm performance. Available at SSRN 1670219.
    Bouncken, R., Gast, J., Kraus, S., & Bogers, M. (2015). Coopetition: A systematic review, synthesis, and future research directions. Review of Managerial Science, 9(3), 577-601.
    Brandenburger, A. M., & Nalebuff, B. J. (1996). Co-opetition. New York: Doubleday.
    Chen, R., & Li, M. (1999). Strategic alliances and new product development: An empirical study of the US semiconductor start-up firms. Journal of Competitiveness Studies, 7(1), 35.
    Churchill, G. A., & Iacobucci, D. (1995). Marketing Research: Methodological Foundations: Dryden Press New York.
    Combs, J. G., & Ketchen, J., David J. (1999). Explaining interfirm cooperation and performance: Toward a reconciliation of predictions from the resource‐based view and organizational economics. Strategic Management Journal, 20(9), 867-888.
    Cooper, D. R., Schindler, P. S., & Sun, J. (2006). Business Research Methods (Vol. 9): Mcgraw-hill New York.
    Dagnino, G. B., & Padula, G. (2002). Coopetition strategy: A new kind of interfirm dynamics for value creation. Paper presented at the Innovative research in management, European Academy of Management (EURAM), second annual conference, Stockholm, May.
    Dalton, D. R., & Kesner, I. F. (1985). Organizational performance as an antecedent of inside/outside chief executive succession: An empirical assessment. Academy of Management Journal, 28(4), 749-762.
    Dorn, S., Schweiger, B., & Albers, S. (2016). Levels, phases and themes of coopetition: A systematic literature review and research agenda. European Management Journal, 34(5), 484-500.
    Dowling, M. J., Roering, W. D., Carlin, B. A., & Wisnieski, J. (1996). Multifaceted relationships under coopetition - Description and theory. Journal of Management Inquiry, 5(2), 155-167.
    Doz, Y. L. (1996). The evolution of cooperation in strategic alliances: Initial conditions or learning processes? Strategic Management Journal, 17, 55-83.
    Enberg, C. (2012). Enabling knowledge integration in coopetitive R&D projects—The management of conflicting logics. International Journal of Project Management, 30(7), 771-780.
    Fernandez, A. S., Le Roy, F., & Gnyawali, D. R. (2014). Sources and management of tension in co-opetition case evidence from telecommunications satellites manufacturing in Europe. Industrial Marketing Management, 43(2), 222-235.
    Fine, C. H. (1998). Clock speed: Winning industry control in the age of temporary advantage. Perseus Books.
    Gast, J., Filser, M., Gundolf, K., & Kraus, S. (2015). Coopetition research: Towards a better understanding of past trends and future directions. International Journal of Entrepreneurship and Small Business, 24(4), 492-521.
    Gnyawali, D. R., & Madhavan, R. (2001). Cooperative networks and competitive dynamics: A structural embeddedness perspective. Academy of Management Review, 26(3), 431-445.
    Gnyawali, D. R., & Park, B. J. (2011). Co-opetition between giants: Collaboration with competitors for technological innovation. Research Policy, 40(5), 650-663.
    Grandori, A., & Neri, M. (1999). The fairness properties of interfirm networks. Interfirm Networks: Organization and Industrial Competitiveness, 41-66.
    Griesinger, D. W. (1990). The human side of economic organization. Academy of Management Review, 15(3), 478-499.
    Gulati, R., Nohria, N., & Zaheer, A. (2000). Strategic networks. Strategic Management Journal, 21(3), 203-215.
    Hambrick, D. C., & Mason, P. A. (1984). Upper echelons: The organization as a reflection of its top managers. Academy of Management Review, 9(2), 193-206.
    Hamel, G. (1991). Competition for competence and interpartner learning within international strategic alliances. Strategic Management Journal, 12(S1), 83-103.
    Hamel, G., Doz, Y. L., & Prahalad, C. K. (1989). Collaborate with your competitors--and win. Harvard Business Review, 67(1), 133-139.
    Hennart, J.-F. (1988). A transaction costs theory of equity joint ventures. Strategic Management Journal, 9(4), 361-374.
    Herrmann, P., & Datta, D. K. (2005). Relationships between top management team characteristics and international diversification: An empirical investigation. British Journal of Management, 16(1), 69-78.
    Hill, C. W. L. (1990). Cooperation, opportunism and the invisible hands: Implications for transaction cost theory. Academy of Management Review, 15(3), 500-513.
    Kanungo, R. N., & Conger, J. A. (1993). Promoting altruism as a corporate goal. Academy of Management Perspectives, 7(3), 37-48.
    Khanna, T., Gulati, R., & Nohria, N. (1998). The dynamics of learning alliances: Competition, cooperation, and relative scope. Strategic Management Journal, 19(3), 193-210.
    King, N., Horrocks, C., & Brooks, J. (2018). Interviews in Qualitative Research: Sage.
    Kogut, B. (1988). Joint ventures: Theoretical and empirical perspectives. Strategic Management Journal, 9(4), 319-332.
    Koza, M. P., & Lewin, A. Y. (1998). The co-evolution of strategic alliances. Organization Science, 9(3), 255-264.
    Lado, A. A., Boyd, N. G., & Hanlon, S. C. (1997). Competition, cooperation, and the search for economic rents: A syncretic model. Academy of Management Review, 22(1), 110-141.
    Lane, P. J., & Lubatkin, M. (1998). Relative absorptive capacity and interorganizational learning. Strategic Management Journal, 19(5), 461-477.
    Lincoln, Y. S., & Guba, E. G. (1985). Establishing trustworthiness. Naturalistic inquiry, 289(331), 289-327.
    Luo. (2004). A coopetition perspective of MNC–host government relations. Journal of International Management, 10(4), 431-451.
    Luo. (2007). A coopetition perspective of global competition. Journal of World Business, 42(2), 129-144.
    Luo, Slotegraaf, R. J., & Pan, X. (2006). Cross-functional "coopetition": The simultaneous role of cooperation and competition within firms. Journal of Marketing, 70(2), 67-80.
    Madhavan, R., Gnyawali, D. R., & He, J. (2004). Two`s company, three`s a crowd? Triads in cooperative-competitive networks. Academy of Management Journal, 47(6), 918-927.
    McKelvey, B. (1997). Quasi-natural organization science. Organization Science, 8(4), 351-380.
    Mention, A. L. (2011). Co-operation and co-opetition as open innovation practices in the service sector: Which influence on innovation novelty? Technovation, 31(1), 44-53.
    Merriam, S. B. (1988). Case Study Research in Education: A Qualitative Approach: Jossey-Bass.
    Mina, A., & Dagnino, G. B. (2016). In search of coopetition consensus: Shaping the collective identity of a relevant strategic management community. International Journal of Technology Management, 71(1-2), 123-154.
    Nachmias, D., & Nachmias, C. (1987). Research Methods in the Social Sciences. (3rd ed.). New York: St. Martin’s Press.
    Padula, G., & Dagnino, G. B. (2007). Untangling the rise of coopetition: The intrusion of competition in a cooperative game. International Studies of Management & Organization, 37(2), 32-52.
    Papadakis, & Barwise, P. (2002). How much do CEOs and top managers matter in strategic decision‐making? British Journal of Management, 13(1), 83-95.
    Papadakis, & Bourantas, D. (1998). The chief executive officer as corporate champion of technological innovation: An empirical investigation. Technology Analysis & Strategic Management, 10(1), 89-110.
    Park, B. J., Srivastava, M. K., & Gnyawali, D. R. (2014). Walking the tight rope of coopetition: Impact of competition and cooperation intensities and balance on firm innovation performance. Industrial Marketing Management, 43(2), 210-221.
    Peng, T. J. A., & Bourne, M. (2009). The coexistence of competition and cooperation between networks: Implications from two taiwanese healthcare networks. British Journal of Management, 20(3), 377-400.
    Penrose, E. (1959). The Theory of the Growth of the Firm. Oxford: Basil Blackwell.
    Prahalad, C. K., & Bettis, R. A. (1986). The dominant logic: A new linkage between diversity and performance. Strategic Management Journal, 7(6), 485-501.
    Quintana-Garcia, C., & Benavides-Velasco, C. A. (2004). Cooperation, competition, and innovative capability: A panel data of european dedicated biotechnology firms. Technovation, 24(12), 927-938.
    Ritala, P., & Hurmelinna-Laukkanen, P. (2009). What`s in it for me? Creating and appropriating value in innovation-related coopetition. Technovation, 29(12), 819-828.
    Ritala, P., & Sainio, L. M. (2014). Coopetition for radical innovation: Technology, market and business-model perspectives. Technology Analysis & Strategic Management, 26(2), 155-169.
    Rusko, R. (2014). Mapping the perspectives of coopetition and technology-based strategic networks: A case of smartphones. Industrial Marketing Management, 43(5), 801-812.
    Sakurai, T. (2002). Low-voltage design or the end of CMOS scaling? Paper presented at the Int. Solid-State Circuits Conf.
    Salancik, G. R., & Pfeffer, J. (1978). A social information processing approach to job attitudes and task design. Administrative science quarterly, 224-253.
    Schwenk, C. R. (1984). Cognitive simplification processes in strategic decision‐making. Strategic Management Journal, 5(2), 111-128.
    Spender, J. (1989). Industry Recipes: An Inquiry into the Nature and Sources of Managerial Judgement. Oxford, UK: Blackwell.
    Stigler, G. J. (1951). The division of labor is limited by the extent of the market. Journal of political economy, 59(3), 185-193.
    Tidstrom, A. (2014). Managing tensions in coopetition. Industrial Marketing Management, 43(2), 261-271.
    Tsai. (2002). Social structure of "coopetition" within a multiunit organization: Coordination, competition, and intraorganizational knowledge sharing. Organization Science, 13(2), 179-190.
    Tsai, & Hsu. (2014). Cross-Functional collaboration, competitive intensity, knowledge integration mechanisms, and new product performance: A mediated moderation model. Industrial Marketing Management, 43(2), 293-303.
    Walley, K. (2007). Coopetition: An introduction to the subject and an agenda for research. International Studies of Management & Organization, 37(2), 11-31.
    Walsh, J. P. (1995). Managerial and organizational cognition: Notes from a trip down memory lane. Organization Science, 6(3), 280-321.
    Wiersema, M. F., & Bantel, K. A. (1992). Top management team demography and corporate strategic change. Academy of Management Journal, 35(1), 91-121.
    Wu, Z. H., Choi, T. Y., & Rungtusanatham, M. J. (2010). Supplier-supplier relationships in buyer-supplier-supplier triads: Implications for supplier performance. Journal of Operations Management, 28(2), 115-123.
    Yin. (1994). Case Study Research: Design and Methods (2nd ed.). CA: Sage.
    Yin, Bateman, P. G., & Moore, G. B. (1985). Case studies and organizational innovation: Strengthening the connection. Knowledge, 6(3), 249-260.
    二、 中文文獻
    司徒達賢. (2005). 策略管理新論: 觀念架構與分析方法: 智勝文化事業有限公司.
    曲威光. (2013). 積體電路與微積電產業. 臺北市: 新陸.
    朱延智. (2014). 高科技產業分析(第三版). 臺北市: 五南.
    張紹勳. (2000). 研究方法: 滄海書局.
    連仁豪. (2005). 半導體晶圓代工產業向前整合趨勢研討-以T公司凸塊封裝為例. (碩士). 國立交通大學.
    陳列全. (2013). 以資源基礎理論 探討半導體產業的整合趨勢. (碩士). 國立清華大學, 新竹市.
    陳建榮. (2021). 半導體封裝公司在先進封裝發展策略之研究. (碩士). 國立陽明交通大學.
    黃千玲. (2013). 從商業生態系統探討半導體產業鏈之競合關係. (碩士). 國立臺灣科技大學, 台北市.
    黃俊英. (1996). 行銷研究. 台北: 華泰書局.
    黃健榮. (2002). 半導體後段產業策略聯盟對供應鏈的影響. (碩士). 國立高雄第一科技大學, 高雄市.
    黃凱亭. (2014). 自建產能或委外:晶圓代工廠建立測試產能的抉擇. (碩士). 國立清華大學, 新竹市.
    黃瑞鴻. (2014). 企業競爭優勢之研究--以台積電及聯電為例. (碩士). 國立中山大學, 高雄市.
    廖瑛瑞. (2013). 半導體產業的雙螺旋動態分析. (碩士). 國立清華大學, 新竹市.
    鄭富紘. (2010). 供應鏈整合績效之探討─以台灣半導體產業為例. (碩士). 南台科技大學, 台南市.
    賴品中. (2018). 企業併購的動態競爭分析 ─ 以台灣半導體封測廠商日月光與矽品合併為例. (碩士). 國立政治大學, 台北市.
    羅嘉雯. (2008). 半導體產業工程鏈服務整合者之探索性研究. (碩士). 國立臺灣大學, 台北市.
    三、 網路資料
    ASE. Heterogeneous Integration (HI). ASE Group. Retrieved from https://ase.aseglobal.com/en/heterogeneous_integration
    Cadence. (2018). Chiplets -- Reinventing systems design. Cadence. Retrieved from https://community.cadence.com/cadence_blogs_8/b/spi/posts/chiplets
    Desai, A. (2020). 2.5D and 3D ICs: New paradigms in ASIC. einfochips. Retrieved from https://www.einfochips.com/blog/2-5d-3d-ics-new-paradigms-in-asic/
    ITRS. (2010). International Technology Roadmap for Semiconductors (ITRS) Updates 2010. Retrieved from http://maltiel-consulting.com/ITRS_2010_Updates_maltiel_semiconductor_consulting.html
    ITRS. (2011). International Technology Roadmap for Semiconductors (ITRS) Updates 2011. Retrieved from https://www.semiconductors.org/resources/2011-international-technology-roadmap-for-semiconductors-itrs/
    Lee, C. (2017). What’s what in advanced packaging. SemiEngineering. Retrieved from https://semiengineering.com/whats-what-in-advanced-packaging/
    Li, S. (2021). 一文看懂先進封裝. Retrieved from https://www.gushiciku.cn/dl/1p4No/zh-tw
    Liu, L. (2021). 後摩爾定律時代 製程微縮不是唯一選項. EE Times Taiwan. Retrieved from https://www.eettaiwan.com/202103xxnt31-scaling-is-not-the-only-option-in-the-post-moore-era/
    Park. (2020). This is not your fathers advanced semiconductor packaging...An EDA perspective. Cadence. Retrieved from https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/tools/ic-package-design-analysis/imaps-dev-pack-20-eda-perspective.pdf
    Schor, D. (2019). Chiplet. WikiChip. Retrieved from https://en.wikichip.org/wiki/chiplet
    SEMI. (2019). 扇出型晶圓級封裝技術,半導體產業變革趨勢. SEMI Taiwan. Retrieved from https://www.semi.org/zh/blogs/technology-trends/packaging/fanout
    TrendForce. (2019). 【集邦點評】AI、5G潮流下,晶圓先進封測成大廠目標,中國IC封測廠能分杯羹?. TrendForce 集邦科技. Retrieved from https://medium.com/@trendforcemkt/%E9%9B%86%E9%82%A6%E9%BB%9E%E8%A9%95-ai-5g%E6%BD%AE%E6%B5%81%E4%B8%8B-%E6%99%B6%E5%9C%93%E5%85%88%E9%80%B2%E5%B0%81%E6%B8%AC%E6%88%90%E5%A4%A7%E5%BB%A0%E7%9B%AE%E6%A8%99-%E4%B8%AD%E5%9C%8Bic%E5%B0%81%E6%B8%AC%E5%BB%A0%E8%83%BD%E5%88%86%E6%9D%AF%E7%BE%B9-66f4901edecf
    TSMC. (1997). 台積公司與日月光集團簽訂聯盟協議虛擬晶圓廠服務擴及構裝階段 台積電新聞集錦. Retrieved from https://pr.tsmc.com/chinese/news/2456
    Walker, J., Freeman, D., & Stromberg, M. (2010). SoC/SiP/3D IC各具優勢 TSV左右晶片演化成敗. 新通訊. Retrieved from https://www.2cm.com.tw/2cm/zh-tw/archives/69CC48F7E2FF43D6B4E3A8547EC5B364
    Wesling, P. (2019). Heterogeneous Integration Roadmap (HIR) 2019 Edition. IEEE Electronics Packaging Society (EPS). Retrieved from https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html
    Yole. (2020a). System-in-Package (SiP) Technology and Market Trends 2020 report. Yole Développement. Retrieved from http://www.yole.fr/SiP_Technology_Market_Overview.aspx
    Yole. (2020b). Status of the Advanced Packaging Industry 2020 report. Yole Développement. Retrieved from http://www.yole.fr/AdvancedPackaging_Industry_MarketFigures_SYNAPS.aspx
    Yole. (2021a). Status of the Advanced Packaging Industry 2021 report. Yole Développement. Retrieved from http://www.yole.fr/Status_Of_The_Advanced_Packaging_Industry_Yole_Sept2021.aspx
    Yole. (2021b). System-in-Package Technology and Market Trends 2021 report. Yole Développement. Retrieved from http://www.yole.fr/System_In_Package_Market_Update_2021.aspx
    Yole. (2021c). Fan-Out WLP and PLP Applications and Technologies 2021 report. Yole Développement. Retrieved from http://www.yole.fr/Fan_Out_WLP_PLP_HiSilicon_Hi1382_2021.aspx
    尹慧中. (2021a). 我半導體產值 明年衝4.5兆. 經濟日報. Retrieved from https://money.udn.com/money/story/11162/5867865?from=edn_hotestlist_storybottom
    尹慧中. (2021b). 余振華:異質封裝 台積電和日月光共創價值. 經濟日報. Retrieved from https://money.udn.com/money/story/5612/5926780?from=edn_newestlist_cate_side
    王彤勻. (2014). InFO比CoWoS成本更低,台積3D IC封裝再突破. MoneyDJ理財網. Retrieved from https://www.moneydj.com/kmdj/news/newsviewer.aspx?a=a78aff30-7ad8-49df-8be9-42819112faaf
    王怡茹. (2020). 台積電高階封裝踩地盤 封測廠危機感倍增? MoneyDJ理財網. Retrieved from https://www.moneydj.com/KMDJ/News/NewsViewer.aspx?a=5f30ae38-2144-44de-b69e-e748f5c4ebb9&c=MB010000
    朱智穎. (2001). 封裝龍頭-日月光及矽品. MoneyDJ 理財網. Retrieved from https://www.moneydj.com/report/zd/zdc/zdcz/zdcz_374F886D-4326-40A0-B042-8F8A53BB2EC0.djhtm
    吳禹潼. (2021). 小晶片Chiplet大商機. 先探投資週刊(2167期). Retrieved from https://www.chinatimes.com/realtimenews/20211031000010-260410?chdtv
    李彥緯. (2021). 5G、物聯網、自駕車、智慧城市、遠距醫療需求旺. 理財周刊. Retrieved from https://www.moneyweekly.com.tw/Magazine/Info/%E7%90%86%E8%B2%A1%E5%91%A8%E5%88%8A/60897/
    李淑蓮. (2020). 《SEMICON Taiwan 2020》先進封裝技術大盤點. 聯合新聞網. Retrieved from https://udn.com/news/story/6871/4779184
    李壽鵬. (2018). 台積電新核心競爭力成型,三星和格芯正在奮起直追!. 壹讀. Retrieved from https://read01.com/DGen6Ad.html
    林宏達, & 林苑卿. (2020). 台積電苦熬10年的「這項技術」如今獨吃蘋果訂單 背後故事竟與梁孟松有關?. 財訊. Retrieved from https://www.wealth.com.tw/articles/58d9c3f8-6cae-44eb-b8b1-742d2f3f2015
    林芳如. (2020). SiP、SoC、IC封測是什麼?5G時代的IC產業鏈全貌白話解析. 數位時代. Retrieved from https://www.bnext.com.tw/article/56653/5g-ic
    林苑卿. (2020). 台積電、鴻海上下夾擊沒在怕!日月光用「兩大秘密武器」穩住封測龍頭霸業 站上10年成長大浪. 財訊. Retrieved from https://www.wealth.com.tw/articles/e2f50132-74e4-4e23-a813-8b9a7de860e9
    林崇銘. (2011). 滿足行動裝置設計要求 SiP技術優勢受青睞. 新通訊. Retrieved from https://www.2cm.com.tw/2cm/zh-tw/tech/5A1A7E6F5FAE441784A877547321D6C5
    邵樂峰. (2021). 先進封裝:八仙過海各顯神通. EE Times Taiwan Retrieved from https://www.eettaiwan.com/20210805nt61-advanced-packaging/
    侯冠州. (2020). 【產業科普】先進封裝正夯,2.5D、3D 和 Chiplets 技術有何特點. 科技新報 Tech News. Retrieved from https://technews.tw/2020/10/01/chiplets-soc-emib/
    張嘉華, & 唐經洲. (2010). TSV技術考驗多 3D IC量產起步難. 新通訊. Retrieved from https://www.2cm.com.tw/2cm/zh-tw/market/9D0AF0DAB05442E29A3868E3E2FE1DF1
    郭家宏. (2021). 摩爾定律的救世主,「先進封裝」成為半導體產業的新寵兒!. 科技報橘 Tech Orange. Retrieved from https://buzzorange.com/techorange/2021/09/23/advanced-packaging-and-moore-law/
    陳妍蓁. (2011). 面對高度整合、低耗能、即時上市的3D IC製造技術及產品應用趨勢. DigiTimes. Retrieved from https://www.digitimes.com.tw/tech/dt/n/shwnws.asp?cnlid=14&id=0000251128_FWY2OCT91YHT6G9AVZFJU
    陳良榕. (2018). 一個「小媳婦部門」為何能讓台積電擊敗三星、獨吃蘋果?. 天下Web only. Retrieved from https://www.cw.com.tw/article/5089325
    陳婉潔. (2020). 先進IC封裝技術往TSV 3D IC為必然發展方向. DigiTimes. Retrieved from https://www.digitimes.com.tw/tech/dt/n/shwnws.asp?cnlid=13&id=0000592916_922LRTQH0M8MGZ7LGGQAU
    黃日燦. (2013). 黃日燦看併購, 垂直整合 日月光成就封測大業 Jones Day. Retrieved from https://www.jonesday.com/zh-hant/insights/2013/07/%E9%BB%83%E6%97%A5%E7%87%A6%E7%9C%8B%E4%BD%B5%E8%B3%BC,-%E5%9E%82%E7%9B%B4%E6%95%B4%E5%90%88-%E6%97%A5%E6%9C%88%E5%85%89%E6%88%90%E5%B0%B1%E5%B0%81%E6%B8%AC%E5%A4%A7%E6%A5%AD
    楊啟鑫. (2021). 半導體小晶片(Chiplet)模式暨異質整合封裝發展趨勢. Retrieved from https://www.moea.gov.tw/MNS/doit/industrytech/IndustryTech.aspx?menu_id=13545&it_id=345
    熊毅晰. (2019). 地表最接近工業4.0!台積電兩大獨門武器首度公開. 天下雜誌(665期). Retrieved from https://www.cw.com.tw/article/5093674?template=transformers
    劉佩真. (2021). 國內外半導體業景氣走向與發展之趨勢. 台灣經濟研究院全球資訊網. Retrieved from https://www.tier.org.tw/achievements/pec3010.aspx?GUID=ff3f4cb2-d90a-40fe-93a8-4c9fb686d257
    劉烱德. (2021). 3D封裝技術及發展趨勢. 恆穩團隊. Retrieved from http://www.pra.com.tw/product_con_A.php?id=1905
    盧智芳. (1998). 共創日月光雙傳奇 — 張虔生、張洪本. 天下雜誌(203期). Retrieved from https://www.cw.com.tw/article/5106455
    蕭文康. (2021). 震撼業界!聯電整合封測業務 54.3億入股頎邦取得近10%股權. 蘋果新聞網. Retrieved from https://tw.appledaily.com/property/20210903/DZOGKHCW2FA5DGHJNP2SEWTJQQ/
    鍾榮峰, & 張建中. (2021). 台積電:異質整合攻系統微縮 面對兩大挑戰. 中央社. Retrieved from https://www.cna.com.tw/news/afe/202111300140.aspx
    譚偉晟. (2020). 日月光遭台積踩地盤 如何守住高階市場 今周刊 1242期. Retrieved from https://www.businesstoday.com.tw/article/category/183015/post/202010070035/%E6%97%A5%E6%9C%88%E5%85%89%E9%81%AD%E5%8F%B0%E7%A9%8D%E8%B8%A9%E5%9C%B0%E7%9B%A4%E3%80%80%E5%A6%82%E4%BD%95%E5%AE%88%E4%BD%8F%E9%AB%98%E9%9A%8E%E5%B8%82%E5%A0%B4
    Description: 碩士
    國立政治大學
    科技管理與智慧財產研究所
    108364132
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0108364132
    Data Type: thesis
    DOI: 10.6814/NCCU202200084
    Appears in Collections:[Graduate Institute of TIPM] Theses

    Files in This Item:

    File Description SizeFormat
    413201.pdf2725KbAdobe PDF21024View/Open


    All items in 政大典藏 are protected by copyright, with all rights reserved.


    社群 sharing

    著作權政策宣告 Copyright Announcement
    1.本網站之數位內容為國立政治大學所收錄之機構典藏,無償提供學術研究與公眾教育等公益性使用,惟仍請適度,合理使用本網站之內容,以尊重著作權人之權益。商業上之利用,則請先取得著作權人之授權。
    The digital content of this website is part of National Chengchi University Institutional Repository. It provides free access to academic research and public education for non-commercial use. Please utilize it in a proper and reasonable manner and respect the rights of copyright owners. For commercial use, please obtain authorization from the copyright owner in advance.

    2.本網站之製作,已盡力防止侵害著作權人之權益,如仍發現本網站之數位內容有侵害著作權人權益情事者,請權利人通知本網站維護人員(nccur@nccu.edu.tw),維護人員將立即採取移除該數位著作等補救措施。
    NCCU Institutional Repository is made to protect the interests of copyright owners. If you believe that any material on the website infringes copyright, please contact our staff(nccur@nccu.edu.tw). We will remove the work from the repository and investigate your claim.
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback