政大機構典藏-National Chengchi University Institutional Repository(NCCUR):Item 140.119/31356
English  |  正體中文  |  简体中文  |  Post-Print筆數 : 27 |  全文筆數/總筆數 : 113311/144292 (79%)
造訪人次 : 50941073      線上人數 : 942
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧：
  • 您可在西文檢索詞彙前後加上"雙引號"，以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋，建議至進階搜尋限定作者欄位，可獲得較完整資料
    •  進階搜尋


    請使用永久網址來引用或連結此文件: https://nccur.lib.nccu.edu.tw/handle/140.119/31356


    題名: 欣興低功率處理器市場發展策略之研究
    Growing strategies of uni-micron through CULV CPU products
    作者: 杜慧雯
    Tu, Amber
    貢獻者: 康榮寶
    Kang, Jungpao
    杜慧雯
    Tu, Amber
    關鍵詞: 發展策略
    日期: 2008
    上傳時間: 2009-09-14 09:51:13 (UTC+8)
    摘要: 欣興低功率處理器市場發展策略之研究
    Printed circuit boards, being one of the most important components in electronics systems as
    it is widely used in a variety of modern electronic end-products including mobile phones, PCs,
    TFT-LCD TVs, consumer electronics, and automobiles. Although the respective industry
    revenue contracted by nearly 20% in 2001 as a result of “Tech Bubble”, its revenue soon
    resumed to grow 5% and 22% in 2003 and 2004 respectively. In 2008, the PCB market value
    has grown from US$33.1 billion in 2003 to an estimated worth of US$48 billion, in line with
    the growth of the global electronic market which had increased from US$893 billion to
    US$1,389 billion.
    Unimicron Technology Corporation was founded in 1990 and publicly listed on Taiwan OTC
    in 1998. As of Mar, 31st, 2009, its consolidated net worth stood at TWD 28.5bn (USD876mn).
    Market capitalization amounted to TWD21.3bn (USD0.65bn), based on a closing price of
    TWD43.6 per share as of Mar, 31st, 2009. In terms of total sales amount, Unimicron is the
    largest PCB producer in Taiwan. On a global basis, it ranks No.2 next to Ibiden (Japan). In
    terms of product, Unimicron is the largest producer of handset PCB in Taiwan, followed by
    Compeq. The company has successively increased its global market share of handset PCB
    from 9% in 2003 to 20% in 2007, and 25% in 2008 through aggressive expansion and
    technology upgrade.
    With Unmicron’s current technology advantages and leading position in High Density
    Interconnects and Chip Scale Package as well as Phoenix Precision Technology’s strong
    knowledge in Flip Chip, it is expected that new Unimicron could without a doubt penetrate
    into PC and Smartphone segments through the consumer ultra-low voltage (CULV) platform.
    Chapter 1: PCB Industry Overview...........................................................................1
    1.1. PCB in IT Industry .....................................................................................................1
    1.1.1. Trend of Global PCB Industry: Market Size ....................................................2
    1.1.2. Geographic Breakdown ....................................................................................2
    1.2. PCB Supply Chain: Major Players, Products & Characteristics ................................3
    1.2.1. Upstream: Material Suppliers and CCL Manufacturers ...................................3
    1.2.2. Mid-Stream PCB Vendors ................................................................................4
    1.2.2.1. Conventional PCB ..............................................................................5
    1.2.2.2. High Density Interconnects (HDI) PCB.............................................6
    1.2.2.3. IC substrates .......................................................................................6
    1.2.2.4. Cost Structure Among Segments........................................................8
    1.2.3. Down-Stream: End-Product Applications ........................................................8
    1.3. Key Success Factors .................................................................................................10
    1.4. Environmental Concerns ..........................................................................................11
    Chapter 2: Case Study: Unimicron...........................................................................12
    2.1. Overview on Unimicrom ..........................................................................................12
    2.1.2. Business Strategy............................................................................................14
    2.1.3. Financial performance ....................................................................................15
    2.1.4. Latest Developments ......................................................................................18
    2.2. Peer Comparison: Major players & Unimicron’s Market Position ..........................21
    Chapter 3: Developments & Trends in IT Industry..................................................28
    3.1. Trends in Global PC Market.....................................................................................28
    3.1.1. Battles Between Notebook and Desktop ........................................................28
    3.1.2. New NB Segmentation: Netbook. ..................................................................29
    3.2. Developments of CULV Processors .........................................................................29
    3.3. Implication of Cooperation between Intel and Nokia: Smart Phone........................31
    Chapter 4: PCB Segment Movement ......................................................................33
    4.1. Reallocation of the Market Shares among PCB Segments.......................................33
    Chapter 5: Conclusion..............................................................................................35
    5.1. Unimicron’s Growth Opportunity and Strategy .......................................................35
    Reference..................................................................................................................38
    Appendix..................................................................................................................40
    參考文獻: 1. Leping Huang and Anne Lee, " Printed Circuit Boards | ASIA PACIFIC," Nomura
    Securities Co Ltd Anchor Report, 24 Apr., p. 1-45, 2009.
    2. Agam Shah, “The new Atom platform will move the chipset alongside the Atom
    processor in a single chip,” IDG News Service, 29 May., p. 1, 2009.
    3. Robert Cheng, Pauline Chen, Darryl Cheng, Jessica Chang, and Jill Su, " Asia PC
    Sector," Credit Suisse Asia Pacific Equity Research, 21 Apr., p. 1-45, 2009.
    4. Henry King and Kevin Lu, " Taiwan: Technology: Hardware," Goldman Sachs (Asia)
    L.L.C., Global Investment Research, 25 Mar., p. 1-5, 2009.
    5. Tse-yong Yao and Steven Pelayo, "PCB Survivors: looking for downturn resiliency,"
    HSBC Global Research, 02 Dec., p. 4-18, 2008.
    6. Edward Yen and Arthur Hsieh, “Unimicron,” UBS Global Equity Research, 20 Mar.,
    p.1-3, 2009.
    7. Anya Chang, Sharon Shih and Jasmine Lu, “Taiwan IC Substrates: Read on
    Unimicron/PPT Merger,” Morgan Stanley Research Asia/Pacific, 23 Mar., p. 1-3, 2009.
    8. Vincent Chen, “Unimicron, Taiwan: PCB/Substrates,” Yuanta Security Equity Research,
    23 Mar., p.1-2, 2009.
    9. Bonny Weng, “Unimicron Technology,” KGI Asia Equity Research, 26 Mar., p. 1-5,
    2009.
    10. James Chiu, William Chen and Daniel Chang, “Unimicron,” Macquarie Research
    Equities, 08 May., p.1-2, 2009.
    11. Anya Chang, Sharon Shih and Jasmine Lu, “Unimicron Merger Concern Resurfacing
    After AGM Approval,” Morgan Stanley Research Asia/Pacific, 10 Jun., p. 1-2, 2009.
    12. Grace Chen, Sharon Shih and Jasmine Lu, “Taiwan PC & Handsets: Monthly Databook,”
    Morgan Stanley Research Asia/Pacific, 15 Oct., p. 3-12, 2008.
    13. James Chiu, William Chen and Daniel Chang, “PCB sector,” Macquarie Research
    Equities, 14 Apr., p.1-13, 2009.
    14. Dennis Wang and Allen Pu, “ Taiwan PCB industry update,” Fubon Equity Research, 15
    Apr., p.1-5, 2009.
    15. CK Cheng, “Taiwan PCB Sector outlook,” CLSA Asia-Pacific Markets, 08 May., P 1-7,
    2009.
    16. 楊喻斐，「08年全球PCB廠排行，欣興 南電 健鼎居前十大」，精實新聞，民國98年
    5月13日，頁I-II。
    17. 劉思良，「個股報告，台燿電子」，元大投顧，民國97年6月2日，頁III。
    18. 「IC載板產業」，元富投顧，民國97年12月10日，頁I –VIII。
    描述: 碩士
    國立政治大學
    國際經營管理碩士班(IMBA)
    96933009
    97
    資料來源: http://thesis.lib.nccu.edu.tw/record/#G0096933009
    資料類型: thesis
    顯示於類別:[國際經營管理英語碩士學程IMBA] 學位論文

    文件中的檔案:

    檔案 大小格式瀏覽次數
    index.html0KbHTML2458檢視/開啟


    在政大典藏中所有的資料項目都受到原著作權保護.


    社群 sharing

    著作權政策宣告 Copyright Announcement
    1.本網站之數位內容為國立政治大學所收錄之機構典藏，無償提供學術研究與公眾教育等公益性使用，惟仍請適度，合理使用本網站之內容，以尊重著作權人之權益。商業上之利用，則請先取得著作權人之授權。
    The digital content of this website is part of National Chengchi University Institutional Repository. It provides free access to academic research and public education for non-commercial use. Please utilize it in a proper and reasonable manner and respect the rights of copyright owners. For commercial use, please obtain authorization from the copyright owner in advance.

    2.本網站之製作，已盡力防止侵害著作權人之權益，如仍發現本網站之數位內容有侵害著作權人權益情事者，請權利人通知本網站維護人員(nccur@nccu.edu.tw)，維護人員將立即採取移除該數位著作等補救措施。
    NCCU Institutional Repository is made to protect the interests of copyright owners. If you believe that any material on the website infringes copyright, please contact our staff(nccur@nccu.edu.tw). We will remove the work from the repository and investigate your claim.
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回饋