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    政大典藏 > College of Commerce > International MBA > Theses >  Item 140.119/31356


    Please use this identifier to cite or link to this item: https://nccur.lib.nccu.edu.tw/handle/140.119/31356


    Title: 欣興低功率處理器市場發展策略之研究
    Growing strategies of uni-micron through CULV CPU products
    Authors: 杜慧雯
    Tu, Amber
    Contributors: 康榮寶
    Kang, Jungpao
    杜慧雯
    Tu, Amber
    Keywords: 發展策略
    Date: 2008
    Issue Date: 2009-09-14 09:51:13 (UTC+8)
    Abstract: 欣興低功率處理器市場發展策略之研究
    Printed circuit boards, being one of the most important components in electronics systems as
    it is widely used in a variety of modern electronic end-products including mobile phones, PCs,
    TFT-LCD TVs, consumer electronics, and automobiles. Although the respective industry
    revenue contracted by nearly 20% in 2001 as a result of “Tech Bubble”, its revenue soon
    resumed to grow 5% and 22% in 2003 and 2004 respectively. In 2008, the PCB market value
    has grown from US$33.1 billion in 2003 to an estimated worth of US$48 billion, in line with
    the growth of the global electronic market which had increased from US$893 billion to
    US$1,389 billion.
    Unimicron Technology Corporation was founded in 1990 and publicly listed on Taiwan OTC
    in 1998. As of Mar, 31st, 2009, its consolidated net worth stood at TWD 28.5bn (USD876mn).
    Market capitalization amounted to TWD21.3bn (USD0.65bn), based on a closing price of
    TWD43.6 per share as of Mar, 31st, 2009. In terms of total sales amount, Unimicron is the
    largest PCB producer in Taiwan. On a global basis, it ranks No.2 next to Ibiden (Japan). In
    terms of product, Unimicron is the largest producer of handset PCB in Taiwan, followed by
    Compeq. The company has successively increased its global market share of handset PCB
    from 9% in 2003 to 20% in 2007, and 25% in 2008 through aggressive expansion and
    technology upgrade.
    With Unmicron’s current technology advantages and leading position in High Density
    Interconnects and Chip Scale Package as well as Phoenix Precision Technology’s strong
    knowledge in Flip Chip, it is expected that new Unimicron could without a doubt penetrate
    into PC and Smartphone segments through the consumer ultra-low voltage (CULV) platform.
    Chapter 1: PCB Industry Overview...........................................................................1
    1.1. PCB in IT Industry .....................................................................................................1
    1.1.1. Trend of Global PCB Industry: Market Size ....................................................2
    1.1.2. Geographic Breakdown ....................................................................................2
    1.2. PCB Supply Chain: Major Players, Products & Characteristics ................................3
    1.2.1. Upstream: Material Suppliers and CCL Manufacturers ...................................3
    1.2.2. Mid-Stream PCB Vendors ................................................................................4
    1.2.2.1. Conventional PCB ..............................................................................5
    1.2.2.2. High Density Interconnects (HDI) PCB.............................................6
    1.2.2.3. IC substrates .......................................................................................6
    1.2.2.4. Cost Structure Among Segments........................................................8
    1.2.3. Down-Stream: End-Product Applications ........................................................8
    1.3. Key Success Factors .................................................................................................10
    1.4. Environmental Concerns ..........................................................................................11
    Chapter 2: Case Study: Unimicron...........................................................................12
    2.1. Overview on Unimicrom ..........................................................................................12
    2.1.2. Business Strategy............................................................................................14
    2.1.3. Financial performance ....................................................................................15
    2.1.4. Latest Developments ......................................................................................18
    2.2. Peer Comparison: Major players & Unimicron’s Market Position ..........................21
    Chapter 3: Developments & Trends in IT Industry..................................................28
    3.1. Trends in Global PC Market.....................................................................................28
    3.1.1. Battles Between Notebook and Desktop ........................................................28
    3.1.2. New NB Segmentation: Netbook. ..................................................................29
    3.2. Developments of CULV Processors .........................................................................29
    3.3. Implication of Cooperation between Intel and Nokia: Smart Phone........................31
    Chapter 4: PCB Segment Movement ......................................................................33
    4.1. Reallocation of the Market Shares among PCB Segments.......................................33
    Chapter 5: Conclusion..............................................................................................35
    5.1. Unimicron’s Growth Opportunity and Strategy .......................................................35
    Reference..................................................................................................................38
    Appendix..................................................................................................................40
    Reference: 1. Leping Huang and Anne Lee, " Printed Circuit Boards | ASIA PACIFIC," Nomura
    Securities Co Ltd Anchor Report, 24 Apr., p. 1-45, 2009.
    2. Agam Shah, “The new Atom platform will move the chipset alongside the Atom
    processor in a single chip,” IDG News Service, 29 May., p. 1, 2009.
    3. Robert Cheng, Pauline Chen, Darryl Cheng, Jessica Chang, and Jill Su, " Asia PC
    Sector," Credit Suisse Asia Pacific Equity Research, 21 Apr., p. 1-45, 2009.
    4. Henry King and Kevin Lu, " Taiwan: Technology: Hardware," Goldman Sachs (Asia)
    L.L.C., Global Investment Research, 25 Mar., p. 1-5, 2009.
    5. Tse-yong Yao and Steven Pelayo, "PCB Survivors: looking for downturn resiliency,"
    HSBC Global Research, 02 Dec., p. 4-18, 2008.
    6. Edward Yen and Arthur Hsieh, “Unimicron,” UBS Global Equity Research, 20 Mar.,
    p.1-3, 2009.
    7. Anya Chang, Sharon Shih and Jasmine Lu, “Taiwan IC Substrates: Read on
    Unimicron/PPT Merger,” Morgan Stanley Research Asia/Pacific, 23 Mar., p. 1-3, 2009.
    8. Vincent Chen, “Unimicron, Taiwan: PCB/Substrates,” Yuanta Security Equity Research,
    23 Mar., p.1-2, 2009.
    9. Bonny Weng, “Unimicron Technology,” KGI Asia Equity Research, 26 Mar., p. 1-5,
    2009.
    10. James Chiu, William Chen and Daniel Chang, “Unimicron,” Macquarie Research
    Equities, 08 May., p.1-2, 2009.
    11. Anya Chang, Sharon Shih and Jasmine Lu, “Unimicron Merger Concern Resurfacing
    After AGM Approval,” Morgan Stanley Research Asia/Pacific, 10 Jun., p. 1-2, 2009.
    12. Grace Chen, Sharon Shih and Jasmine Lu, “Taiwan PC & Handsets: Monthly Databook,”
    Morgan Stanley Research Asia/Pacific, 15 Oct., p. 3-12, 2008.
    13. James Chiu, William Chen and Daniel Chang, “PCB sector,” Macquarie Research
    Equities, 14 Apr., p.1-13, 2009.
    14. Dennis Wang and Allen Pu, “ Taiwan PCB industry update,” Fubon Equity Research, 15
    Apr., p.1-5, 2009.
    15. CK Cheng, “Taiwan PCB Sector outlook,” CLSA Asia-Pacific Markets, 08 May., P 1-7,
    2009.
    16. 楊喻斐，「08年全球PCB廠排行，欣興 南電 健鼎居前十大」，精實新聞，民國98年
    5月13日，頁I-II。
    17. 劉思良，「個股報告，台燿電子」，元大投顧，民國97年6月2日，頁III。
    18. 「IC載板產業」，元富投顧，民國97年12月10日，頁I –VIII。
    Description: 碩士
    國立政治大學
    國際經營管理碩士班(IMBA)
    96933009
    97
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0096933009
    Data Type: thesis
    Appears in Collections:[International MBA] Theses

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