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    Title: Knowledge complementarity and boundary spanning for continuous innovation
    Authors: Shang, Shari S. C.;Yao, Chen-Yen
    尚孝純;姚成彥
    Contributors: 科管所
    Keywords: Continuous innovation;Customer demands;Global Enterprises;Information and Communication Technologies;Knowledge interaction;Rapid development;Technological knowledge;Customer satisfaction;Economics;Industrial management;Sales;Technology
    Date: 2010
    Issue Date: 2015-06-29 18:00:14 (UTC+8)
    Abstract: With the increase of customer demands and rapid development of information and communication technologies, enterprises are facing strenuous competition. Global enterprises are currently engaged in continuous innovation to compete and sustain themselves in the dynamic changing market. Both technological and customer knowledge have been identified as crucial for building knowledge complementarity for delivery of innovation. Most studies in the literature focus on testing for the existence of complementarity between inputs and the effect on output, this study focus on explaining how technological knowledge complements customer knowledge span boundaries to achieve innovation. Based on the concept of boundary spanning, this study is to design a useful instrument to measure knowledge complementarity for continuous innovation. The result is to provide the operationalizable indexes of the scope and depth of knowledge interaction for knowledge complementarity. Finally, different levels of scope and depth of knowledge interaction for knowledge complementarity will affect innovation. © 2010 IEEE.
    Relation: PICMET `10 - Portland International Center for Management of Engineering and Technology, Proceedings - Technology Management for Global Economic Growth, 2010, 論文編號 5602182, Pages 726-730, Portland International Center for Management of Engineering and Technology - Technology Management for Global Economic Growth, PICMET `10; Phuket; Thailand; 18 July 2010 到 22 July 2010; 類別編號CFP10766-CDR; 代碼 82433
    Data Type: conference
    Appears in Collections:[Graduate Institute of TIPM] Proceedings

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