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Title: | 全球手機市場暨台灣手機板供需分析 |
Authors: | 王明芬 |
Contributors: | 吳文傑 王明芬 |
Date: | 2005 |
Issue Date: | 2009-09-14 09:46:47 (UTC+8) |
Abstract: | 全球手機市場暨台灣手機板產業之供需分析 1. Introduction…………………………………………………………1
1.1 Research background and motivation……………………………1
1.2 Methodology...………………………………………………………2
2. Industry Overview……………………………………………………4
2.1 Global PCB industry as a glance.………………………………4
2.2 Printed circuit board in Taiwan……………………………….8
2.3 Competitiveness analysis of PCB industry in Asia.………15
3. Handset PCB Suppliers Analysis – Taiwan……………………26
3.1 Top 4 handset PCB manufacturers at a glance–Taiwan……26
3.1.1Compeq: The long industrial leader strengthens its stance in global market share………………………………………………26
3.1.2 Unimicron chasing aggressively behind Compeq in a bid to lead the local market…………………………………………………32
3.1.3 Unitech is standing neck-to-neck to Unimicron, struggling to move upwards………………………………………………………..35
3.1.4 WUS keeps steadily in forth place, trying to bridge the gap between the leaders…………………………………………37
3.2 Taiwan handset PCB supply, historical performance………40
3.3 Determinants of supply………………………………………….46
3.4 Taiwan handset PCB future forecast…………………………48
4. Global Handset Development and Demand Forecasts…………53
4.1Worldwide handset development by geographic regions……53
4.2 Worldwide handset demand, historical performance………56
4.3 Worldwide handset device performance, future forecast…62
4.4 Top players as a glance…………………………………………67
4.5 Major mobile phone manufacturers market share forecast…74
5. Global handset demand and handset PCB supply correlations.79
5.1 Handset demand vs. handset PCB supply, historical performance…79
6. Taiwan PCB supply future forecast…………………………….82
6.1 Big-four production capacity forecast (what can be offered)…………82
6.2 Forming threat from mainland China………………………….83
6.3 Global handset demand the major driving force………….85
6.4 Sustainable technology capability the key to success……86
6.5 Partnership with handset manufacturer………………………87
7. Conclusion…………………………………………...…………….88
References…………………………………………………………….91 |
Reference: | -台灣電刷路板協會, “台灣電路板市場現況調查報告”, 民國91年10月 -白蓉生, “台灣印刷電路板業之簡介(上)”, 電子檢測興品管季刊, 第28,期1996 -白蓉生, “台灣印刷電路板業之簡介(中)”, 電子檢測興品管季刊, 第29,期1997 -白蓉生, “台灣印刷電路板業之簡介(下)”, 電子檢測興品管季刊, 第30,期1997 -台灣電路板協會, “TPCA NEWS, 第236期”, 2003 -台灣電路板協會, “TPCA NEWS, 第238期”, 2004 -台灣電路板協會, “TPCA NEWS, 第241期”, 2004 -台灣電路板協會, “TPCA NEWS, 第244期”, 2004 -台灣電路板協會, “TPCA NEWS, 第246期”, 2004 -李純君, “PCB景氣分析”, 電子時報, 2003/10/30-2003/11/1 -吳治忠, “印刷電路板工業”, 經濟部工業局資料, 1999 -林泰延, “2004年印刷電路板 -陳忠輝, “印刷電路板之現況與未來發展趨勢”, 印刷科技, 2004年 12月 -黃文鑫, “印刷電路板產業”, 產業調查與技術季刊, 2004年8月 -李褀菁, “印刷電路板產業風雲再起台灣地位舉足輕重”, 新電子科技, 2004年4月 -藍浩益, “透視印刷電路板的機會與未來”, 電工資訊雜誌, 2003年9月 -李祺菁, “由手機產業發展趨勢探索手機板之市場機會”, 工業材料, 2004年4月 -林定皓, ” 印刷電路板簡介. 入門篇”, 台灣電路板協會, 2005年5月 -張世錚, “手機暨其零組件產業概況” , 永昌證券投資季刊, 2003年1月 -汪思源, “行動通訊產業”, 2004年9月 -IDC Press Release, “IDC Expects Sustained Growth in the Worldwide Mobile Phone Market”, 04 Sep 2003 -IDC Press Release, “Western European Mobile Phone Forecast and Analysis, 2004-2009”, May 2005 -IDC Press Release, “Worldwide Mobile Phone Semiconductor 2005-2009 Forecast and Analysis”, April 2005 -IDC Press Release, “Worldwide Mobile Phone 2005-2009 Forecast and Analysis”, May 2005 -iSuppli Press Release, “iSuppli Raises Mobile-Phone Forecast; Nokia Pads Market Lead”, November 2004 -iSuppli Press Release, “iSuppli ups 2005 Mobile-Phone Forecast on Strong Subscriber Growth”, October 2005 -Gartner Press Release, “Forecast: Mobile Phone Memory Consumption”, October 2005 -www.digitimes.com -www.nokia.com -www.motorola.com -www.samsung.com -www.sonyericsson.com -www.compeq.com.tw |
Description: | 碩士 國立政治大學 國際經營管理碩士班(IMBA) 92933017 94 |
Source URI: | http://thesis.lib.nccu.edu.tw/record/#G0092933017 |
Data Type: | thesis |
Appears in Collections: | [國際經營管理英語碩士學程IMBA] 學位論文
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