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    政大典藏 > College of Commerce > MBA Program > Theses >  Item 140.119/146447
    Please use this identifier to cite or link to this item: https://nccur.lib.nccu.edu.tw/handle/140.119/146447


    Title: 以4C架構探討台灣高科技業廠務供應系統整合產業 –以S公司為例
    Research of Exploring the System Integration Engineering Industry in Taiwan Using the 4C Framework: A Case Study of Company S
    Authors: 侯瑞涵
    Hou, Jui Han
    Contributors: 巫立宇
    林宜霓

    Wu, Li Yu
    Lin, Yi Ni

    侯瑞涵
    Hou, Jui Han
    Keywords: 高科技業廠務供應系統整合產業
    半導體業
    綠色製程
    System Integration Engineering Industry,
    Semiconductor industry
    4C
    Date: 2023
    Issue Date: 2023-08-02 13:36:02 (UTC+8)
    Abstract: 隨著半導體產業的蓬勃發展,高科技業廠務供應系統整合產業作為其系統解決方案提供者,亦有著豐沛的市場機會與發展可能性。伴隨 2019 年底爆發的新冠肺炎疫情,深深影響了產業價值鏈的組成與韌性,儘管需求仍然強勁,然而廠商則面臨著難題:該如何在疫情影響下穩定產業價值鏈,提高營運效率、維持生產品質,甚至是研發更創新的零組件或製程,以因應疫情的衝擊與居高不下的需求。
    另外,隨著環保意識的興盛,全球有著共同的環保計畫,各國政府也逐步訂定法規來追求綠色製程,減少碳足跡、環保再利用等成為各家廠商目前所需思考的策略方向。而高科技業廠務供應系統整合產業業者則在這樣的領域也同樣扮演著關鍵角色,該如何在一般的系統整合服務外,能夠延伸價值提供半導體廠商綠色解決方案,將會決定高科技業廠務供應系統整合業者是否能成為各家半導體廠商之重要策略夥伴。
    台灣的半導體先進製程產業與高科技業廠務供應系統整合產業皆相較其他產業而言較為封閉,主要之B2B銷售模式仰賴人脈關係、過去合作關係,產業結構難以撼動、競爭模式較無彈性、且銷售模式單一。因此本研究認為高科技業廠務供應系統整合產業業者若能夠跳脫現況、抓到新機會點,將成為競爭之關鍵。
    本研究將以在台灣較具長久整合能力和規模的個案公司S公司作為討論對象,透過訪談,了解S公司目前之現行銷售流程、市場、產品與服務競爭力等進行資訊搜集,並透過文獻架構作為分析,給予S公司未來於B2B銷售模式上之建議。
    本研究結論認為S公司未來主要可發展方向為市場開發與產品開發。在各項內部條件與外部挑戰的權衡下,S公司未來應嘗試先以現有之一站式整合產品,擴張至其他中小型市場;抑或是因應綠色製程的趨勢,積極開發相關技術與產品,把握該市場的早期成長性。
    With the vigorous development of the semiconductor industry, the System Integration Engineering Industry, as a provider of system solutions, has abundant market opportunities and development potential. However, with the outbreak of the COVID-19 pandemic at the end of 2019, it deeply affected the composition and resilience of the industry value chain. Despite the strong demand, companies are facing challenges: How can they stabilize the industry value chain, improve operational efficiency, maintain product quality, and even develop more innovative components or processes to cope with the impact of the pandemic and high demand.
    Both Taiwan`s advanced semiconductor manufacturing industry and the System Integration Engineering Industry are relatively closed compared to other industries. Their main B2B sales model relies on personal connections and past collaborations. The industry structure is difficult to disrupt, the competition model has limited flexibility, and the sales model is predominantly singular. Therefore, it is believed that whether System Integration Engineering Industry players can understand the advantages and pain points of the sales model will be the key to competition.
    This research focuses on Case Company S in Taiwan, analyzing sales processes, market, and competitiveness. Recommendations for the B2B sales model will be based on interviews and literature analysis.
    Reference: 中文文獻
    巫立宇、邱志聖(2021)。銷售與顧客關係管理(二版)台北市:新陸書局。
    邱志聖(2020)。策略行銷分析:架構與實務運用(四版)台北市:智勝出版社。

    網路資料
    台積電2022卓越廠務設施建設優良供應商 帆宣獲肯定(2023)。取自:
    https://money.udn.com/money/story/5612/6919899

    資策會:2022 全球半導體市場規模 6135 億美元、成長 10.4% 台灣半導體成長率 17.5% 產值達 4.36 兆元(2022)。取自:
    https://www.owlting.com/news/articles/110894
    Description: 碩士
    國立政治大學
    企業管理研究所(MBA學位學程)
    110363081
    Source URI: http://thesis.lib.nccu.edu.tw/record/#G0110363081
    Data Type: thesis
    Appears in Collections:[MBA Program] Theses

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