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Title:	探討調適性學習行為-以半導體工程師排除晶圓缺陷工作實務為例 Adaptive learning in semiconductor industry
Authors:	陳維中
Contributors:	蕭瑞麟 Xiao, Ruey Lin 陳維中
Keywords:	情境學習調適性學習 situated learning adaptive learning
Date:	2010
Issue Date:	2011-09-29 16:41:13 (UTC+8)
Abstract:	我國專業晶圓代工產業已是全球半導體產業鏈中不可或缺一環，此創新之商業模式不但帶動了全球半導體產業鏈的重整，更為我國半導體產業奠定了雄厚的基礎。但是無法快速回應晶圓缺陷問題與縮短工程師培訓時間，卻仍是台灣半導體產業發展近四十幾年來的瓶頸。此問題的延誤不傴使晶圓廠耗損巨額的成本，更承擔喪失國際客戶訂單的風險。因此，如何使半導體工程師提升工作效率，與如何有效培養新進工程師，如今已成為半導體業界刻不容緩之議題。在知識經濟時代中，為企業打造適宜之知識管理模式是產、官、學界所致力的目標。但多數的研究以資訊科技所主導的知識管理系統為範疇，鮮少研究去探索知識工作者陎臨求解問題的困境中，是如何依循著問題情境，如何在其中摸索，進而發展出解決方案的詳細過程。有鑑於此，本研究選擇以詮釋型個案研究方法，深入訪察半導體工程師工作實務，藉此瞭解工程師於維修情境中排除晶圓缺陷的樣貌。經由探討排除晶圓缺陷的工作實務中發現，工程師具備了四禑與「情境」調適性學習(adaptive learning)((Tyre and von Hippel,1997)的歷程：第一、工程師必頇在問題情境中，辨認隱藏於情境當中之線索，並賦與線索意義而展開偵察行動。第二、工程師在偵察過程中，頇不斷地依情境調整收集資料技巧，挖掘出更多或更深層的資訊。第三、工程師適當的工具與資源，有效率地萃取更多的資訊。第四、工程師彼此之間依情境發展出最適行為模式，得以順利整合跨部門執行偵察行動。本研究著重於解析工程師在問題情境中，不斷學習與調適之詳細過程，並指出調適性學習如何在排除晶圓異常工作中扮演重要的角色。最後，針對調適性學習行為提出具體的理論與實務意涵，以供組織未來進行人員培訓與知識管理之參考。第一章緒論.................................................................................................................. 1 第一節、研究背景與動機.................................................................................... 1 第二節、研究目的與研究問題............................................................................ 3 第三節、論文章節安排........................................................................................ 7 第二章文獻探討.......................................................................................................... 8 第一節、情境學習(situated learning) .................................................................. 9 一、不具「絕對性」的知識........................................................................ 9 二、不具「可攜性」的知識........................................................................ 9 第二節、在實踐中學習(learning in practices) .................................................. 10 第三節、在社會互動中學習(learning in social interactions) ............................ 13 第四節、在實體情境中學習(learning in physical contexts) ............................. 14 第五節、調適性學習(adaptive learning) ........................................................... 15 第三章研究方法........................................................................................................ 18 第一節、個案選擇.............................................................................................. 19 第二節、資料搜集.............................................................................................. 23 一、實地參與觀察(Participant Observation) ............................................. 23 二、訪談(Interviews) .................................................................................. 24 三、資料文件(Documents) ......................................................................... 25 第三節、資料分析.............................................................................................. 26 第四章研究發現........................................................................................................ 29 第一節、晶圓缺陷排除工作實務...................................................................... 31 第二節、個案一：晶圓編號中的玄機.............................................................. 35 一、抽絲剝繭.............................................................................................. 36 二、擴大的災情.......................................................................................... 37 三、击起的軟墊與3的倍數...................................................................... 39 四、調適性學習行為描述.................................................................. 42 第三節、晶圓缺陷排除個案二：刮痕背後的真相.......................................... 52 一、兩道直線型刮痕.................................................................................. 52 二、來自機器手臂的訊息.......................................................................... 54 三、偵察新契機.......................................................................................... 56 四、人為的疏失.......................................................................................... 58 五、調適性學習行為描述.......................................................................... 58 第四節、晶圓缺陷排除個案三：晶圓切片手術.............................................. 69 一、龐大的污染物...................................................................................... 69 二、晶圓檢驗室.......................................................................................... 71 三、蝕刻部門的質疑.................................................................................. 73 iii 四、污染物成份分析.................................................................................. 76 五、老舊的晶圓匣...................................................................................... 77 六、調適性學習行為描述.......................................................................... 78 第五節、調適性學習行為模式分析.................................................................. 86 一、調適性學習行為模式分析.................................................................. 86 第五章討論................................................................................................................ 91 第一節、理論意涵.............................................................................................. 91 第二節、實務意涵.............................................................................................. 96 第六章結論與建議.................................................................................................... 98 第一節、研究結論.............................................................................................. 98 第二節、研究限制.............................................................................................. 99 第三節、研究建議.............................................................................................. 99 參考文獻.................................................................................................................... 100 一、英文部分.................................................................................................... 100 圖目錄圖3-1 我國半導體專業分工產業鏈 ......................................................................... 19 圖4-1軟墊位置示意圖 .............................................................................................. 39 圖4-2 晶圓損傷示意圖 ............................................................................................. 52 表目錄表3-1 我國半導體產業產值 ..................................................................................... 20 表3-2 訪談人數表 ..................................................................................................... 25 表4-1、調適性學習表格（個案一） ....................................................................... 44 表4-1(續)、調適性學習表格（個案一）................................................................. 45 表4-1(續)、調適性學習表格（個案一）................................................................. 46 表4-1(續)、調適性學習表格（個案一）................................................................. 47 表4-2 調適性學習圖表（個案二） ......................................................................... 59 表4-2（續）調適性學習圖表（個案二） ............................................................. 60 表4-2（續）調適性學習圖表（個案二） ............................................................. 61 表4-2（續）調適性學習圖表（個案二） ............................................................. 62 表4-2（續）調適性學習圖表（個案二） ............................................................. 63 表4-2（續）調適性學習圖表（個案二） ............................................................. 64 表4-3 調適性學習圖表（個案三） ......................................................................... 79 表4-3（續）調適性學習圖表（個案三） ............................................................. 80 表4-3（續）調適性學習圖表（個案三） ............................................................. 81 iv 表4-5 學習如何將既有知識運用於情境之中 ......................................................... 87 表4-6 學習如何在情境中持續學習 ......................................................................... 88 表4-7 學習如何在不同情境中相輔相成 ................................................................. 90 表5-1 調適性學習比較 ............................................................................................. 94
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Description:	碩士國立政治大學科技管理研究所 96359020 99
Source URI:	http://thesis.lib.nccu.edu.tw/record/#G0096359020
Data Type:	thesis
Appears in Collections:	[Graduate Institute of Technology and Innovation Management] Theses

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