Loading...
|
Please use this identifier to cite or link to this item:
https://nccur.lib.nccu.edu.tw/handle/140.119/158322
|
| Title: | 台韓半導體先進封裝之銷售與技術策略規劃研究
The Sales and Technology Strategy of Advanced Semiconductor Packaging in Taiwan and South Korea |
| Authors: | 吳明倫
Wu, Ming-Lun |
| Contributors: | 黃家齊
吳明倫
Wu, Ming-Lun |
| Keywords: | 半導體
先進封裝
銷售策略
技術策略
台韓比較
Semiconductor
Advanced Packaging
Sales Strategy
Technology Strategy
Taiwan–Korea Comparison |
| Date: | 2025 |
| Issue Date: | 2025-08-04 13:00:46 (UTC+8) |
| Abstract: | 本研究旨在深入探討台灣與韓國在半導體先進封裝領域的銷售與技術策略。在全球半導體產業競爭日益激烈的背景下，先進封裝技術已成為提升晶片效能、降低功耗、縮小尺寸的關鍵。本研究針對台積電、日月光、三星、Amkor等領先企業進行分析，探討其銷售模式、市場策略、技術發展與全球佈局上的差異，進一步比較台韓企業在客戶群、定價策略與供應鏈管理的異同。
研究發現，台灣企業以專業代工與供應鏈整合能力見長，特別在CoWoS與SoIC平台已具備成熟商業模式；韓國企業則仰賴IDM垂直整合與政府政策支持，強化記憶體與系統級整合的競爭力。在高效能運算與AI應用領域，台積電憑藉先進封裝能力居於領先地位，而三星尚處於技術追趕階段。日月光與Amkor分別為台韓封測生態的代表，展現不同的市場定位與服務強項。
本研究也指出，先進封裝發展促使晶圓代工與封測廠由傳統分工轉向策略競合，尤其以台積電與Amkor於美國亞利桑那州的合作為代表案例，反映產業結構與商業模式正在調整。此外，台韓企業未來的全球市場定位，將取決於其是否能靈活運用技術創新、客戶整合、在地化生產與國際策略聯盟等多元策略。
研究採用次級資料分析方法，蒐集市場調查報告、產業分析、企業財報等資訊，並輔以作者所屬公司與台積電、日月光、三星、Amkor等企業於先進封裝領域的實務合作經驗，以掌握產業第一手觀察，補強公開資料的不足。
研究範圍涵蓋Fan-out、2.5D、3D IC等先進封裝技術，並從銷售策略與技術策略兩大主軸切入，結合SWOT分析架構，全面評估台韓在先進封裝領域的優勢與挑戰。最終，提出企業應強化研發投入、供應鏈彈性、人才培育與跨國合作的建議；政府層面運用鑽石模型（Diamond Model）切入，應推動基礎設施建設、政策補助與智慧財產保護，以厚植競爭韌性並鞏固國際地位。
本研究不僅為學術界提供一套深入理解台韓半導體封裝策略的研究基礎，亦為企業與政策制定者提供實務參考，以應對全球半導體供應鏈重組與技術演進所帶來的多重挑戰。
This study aims to explore the sales and technology strategies of Taiwan and South Korea in the field of advanced semiconductor packaging. Amid intensifying global semiconductor competition, advanced packaging technologies have become critical for enhancing chip performance, reducing power consumption, and minimizing device size. This research analyzes leading companies including TSMC, ASE, Samsung, and Amkor, examining differences in their sales models, market strategies, technology development approaches, and global deployment. It also compares the two countries’ approaches in customer targeting, pricing, and supply chain management.
Findings indicate that Taiwanese companies excel in specialized foundry services and supply chain integration, with mature commercialization platforms such as CoWoS and SoIC. In contrast, Korean firms leverage IDM vertical integration and strong government policy support to strengthen their competitiveness in memory and system-level integration. In high-performance computing and AI applications, TSMC leads with advanced packaging capabilities, while Samsung remains in a catch-up phase. ASE and Amkor represent the respective packaging ecosystems in Taiwan and Korea, each with differentiated market positioning and service strengths.
The study also observes a growing trend of competition-collaboration (coopetition) between foundries and OSATs in advanced packaging, as seen in the strategic partnership between TSMC and Amkor in Arizona, USA. The evolution from traditional division of labor to collaborative innovation reflects a shift in industry structure and business models. Furthermore, future global market positioning of Taiwan and Korea will depend on their ability to flexibly leverage strategies such as technological innovation, customer integration, localization, and international alliances.
A secondary data analysis approach was adopted, utilizing market research reports, industry analyses, and financial statements, complemented by the author’s firsthand experience from business collaborations with TSMC, ASE, Samsung, and Amkor in advanced packaging. This combination provided deeper industry insights beyond what is available from public information.
The research focuses on key advanced packaging technologies including fan-out, 2.5D, and 3D IC. It evaluates the strengths and challenges of Taiwanese and Korean enterprises using SWOT analysis across two strategic dimensions: sales and technology. The study concludes with comprehensive recommendations—companies should enhance R&D investments, improve supply chain resilience, nurture talent, and foster cross-border collaboration; while governments should strengthen infrastructure, provide financial incentives, and reinforce intellectual property protection to bolster global competitiveness.
This study contributes to academic understanding of the strategic development in Taiwan and South Korea’s advanced packaging sectors and offers practical insights for businesses and policymakers to respond to emerging challenges in the evolving global semiconductor landscape. |
| Reference: | 1. Bish, J., Stewart, D., Ramachandran, K., Lee, P., & Beerlage, S. (2022). A new dawn for European chips. https://www2.deloitte.com/us/en/insights/industry/technology/semiconductor-chip-shortage-supply-chain.html
2. Byun, B.-M., & Ahn, B. (1989). Growth of the Korean semiconductor industry and its competitive strategy in the world market. Technovation, 9(8), 635. https://doi.org/10.1016/0166-4972(89)90004-7
3. Chai, T., Ho, D., Chong, S., Hsiao, H., Soh, S., Lim, S., PS, S. L., Wai, E. L. C., BL, L., WW, S., Gk, L., TS, P., Lim, K. C. S., SH, S. L., & Yl, Y. (2020). Fan-Out Wafer Level Packaging Development Line. 440. https://doi.org/10.1109/eptc50525.2020.9315155
4. Chang, M., Lin, C., Shen, C., Wang, S. W., Chang, K. C., Chang, K., & Yeh, W.-K. (2021). The role of government policy in the building of a global semiconductor industry. Nature Electronics, 4(4), 230. https://doi.org/10.1038/s41928-021-00575-z
5. Chang, P. L., Lung, S. S.-C., & Hsu, C. W. (1999). The evaluating model for the technology needs of Taiwan high-tech industries. International Journal of Technology Management, 18, 133. https://doi.org/10.1504/ijtm.1999.002758
6. Chang, Y.-H. (2023). Advanced Semiconductor Packaging: Trends and Growth Drivers. https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-trends-and-growth-drivers/29313
7. Chen, C.-F., & Sewell, G. (1996). Strategies for technological development in South Korea and Taiwan: the case of semiconductors. Research Policy, 25(5), 759. https://doi.org/10.1016/0048-7333(95)00861-6
8. Choi, J. (2023). Intense Battle Over US$90 Billion ‘Semiconductor Packaging’ Market. https://www.businesskorea.co.kr/news/articleView.html?idxno=201165
9. Germann, J., Rolf, S., Baines, J., & Starrs, S. (2024). A Chip War Made in Germany? US Techno‐Dependencies, China Chokepoints, and the German Semiconductor Industry. Politics and Governance, 12. https://doi.org/10.17645/pag.8265
10. Gottscho, R. A., Levine, E. V., Liu, T. K., McIntyre, P. C., Mitra, S., Murmann, B., Rabaey, J. M., Salahuddin, S., Shih, W. C., & Wong, H. ‐S. P. (2022). Innovating at Speed and at Scale: A Next Generation Infrastructure for Accelerating Semiconductor Technologies. arXiv (Cornell University). https://doi.org/10.48550/arxiv.2204.02216
11. Hsieh, Y., Lin, N., & Chiu, H.-C. (2002). Virtual factory and relationship marketing—a case study of a Taiwan semiconductor manufacturing company. International Journal of Information Management, 22(2), 109. https://doi.org/10.1016/s0268-4012(01)00049-4
12. Hunt, W., & Zwetsloot, R. (2020). The Chipmakers: U.S. Strengths and Priorities for the High-End Semiconductor Workforce. https://doi.org/10.51593/20190035
13. Inoshita, K. (2024). Global Semiconductor Strategies: A Comparative Analysis of the USA, Japan, China and The EU. https://www.linkedin.com/pulse/global-semiconductor-strategies-comparative-analysis-usa-ken-inoshita-8aeqc
14. Keller, W. W., & Pauly, L. W. (2000). Crisis and Adaptation in East Asian Innovation Systems: The Case of the Semiconductor Industry in Taiwan and South Korea. Business and Politics, 2(3), 327. https://doi.org/10.2202/1469-3569.1014
15. Lai, H. C., Chang, S.-C., & Shyu, J. Z. (2004). The innovation policy priorities in industry evolution: the case of Taiwan’s semiconductor industry. International Journal of Foresight and Innovation Policy, 1, 106. https://doi.org/10.1504/ijfip.2004.004617
16. Lin, G. T. R., Yu, H. C., Hsieh, A. Y. L., & Chou, J. C. (2009). Technology management and strategy composition: innovation of IC foundry. Journal of Intelligent Manufacturing, 21(6), 885. https://doi.org/10.1007/s10845-009-0265-y
17. Naumann, F., & Schnitzer, M. (2024). Rationales for Industrial Policy in the Semiconductor Industry. Intereconomics, 59(5). https://doi.org/10.2478/ie-2024-0053
18. Nenni, D. (2023). TSMC 2023 North America Technology Symposium Overview Part 3. https://semiwiki.com/semiconductor-manufacturers/tsmc/328139-tsmc-2023-north-america-technology-symposium-overview-part-3/
19. Paché, G. (2024). Do Tensions in the South China Sea Herald the Collapse of Global Supply Chains? International Journal of Managing Value and Supply Chains, 15(3). https://doi.org/10.5121/ijmvsc.2024.15301
20. Tung, A. (2001). Taiwan’s Semiconductor Industry: What the State Did and Did Not. Review of Development Economics, 5(2), 266. https://doi.org/10.1111/1467-9361.00123
21. Tyson, M. (2023). Veteran TSMC R&D Exec Joins Samsung’s Chip Packaging Team. https://www.tomshardware.com/news/tsmc-samsung-exec-rd
22. Wang, C., Peng, Y.-C., Hsueh, M.-H., & Wang, Y.-H. (2020). The Selection of Strategic Alliance in IC Packaging and Testing Industry with DEA Resampling Comparative Evaluation. Applied Sciences, 11(1). https://doi.org/10.3390/app11010204
23. Wang, C.-H., & Lin, H.-C. (2021). Competitive substitution and technological diffusion for semiconductor foundry firms. Advanced Engineering Informatics, 48. https://doi.org/10.1016/j.aei.2021.101254
24. Wang, C.-T., & Chiu, C.-S. (2013). Competitive strategies for Taiwan’s semiconductor industry in a new world economy. Technology in Society, 36, 60. https://doi.org/10.1016/j.techsoc.2013.12.002
25. Yang, C., Lin, K.-P., & Chen, K. (2019). Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process. Applied Sciences, 9(13), 2623. https://doi.org/10.3390/app9132623
26. Zhang, X., & Liu, W. (2009). The Study of the Use of FDI to Enhance the Product Competitiveness of Integrated Circuits and Micro-electronic Components. International Business Research, 1(3). https://doi.org/10.5539/ibr.v1n3p48
27. 李雯琪. (2022). 半導體晶圓代工廠商與封測廠商競合關係之探討─以台積電與日月光為例. https://hdl.handle.net/11296/t26tp8
28. Yole Intelligence《Advanced Packaging Market Monitor Q4 2024》https://www.yolegroup.com/product/quarterly-monitor/advanced-packaging-market-monitor-q4-2024/ |
| Description: | 碩士
國立政治大學
經營管理碩士學程(EMBA)
112932038 |
| Source URI: | http://thesis.lib.nccu.edu.tw/record/#G0112932038 |
| Data Type: | thesis |
| Appears in Collections: | [經營管理碩士學程EMBA] 學位論文
|
Files in This Item:
| File |
Description |
Size | Format | |
|---|
| 203801.pdf | | 1975Kb | Adobe PDF | 0 | View/Open |
|
All items in 政大典藏 are protected by copyright, with all rights reserved.
|
