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| Title: | 探討第三方機構介入供應商評選機制之研究-以電路板採購流程為例
Exploring Supplier Selection Mechanism Involved with 3rd Party Agency - A Case Study of Procurement Process in the PCB Industry |
| Authors: | 李明旺
Lee, Ming-Wang |
| Contributors: | 羅明琇
Lo, Ming-Shiow
李明旺
Lee, Ming-Wang |
| Keywords: | 電路板
供應鏈管理
第三方機構
供應商評選
一站式服務
Printed Circuit Board (PCB)
SCM ( Supplier Chain Management )
Reliability
3rd Party Agency
One stop service |
| Date: | 2019 |
| Issue Date: | 2019-02-12 15:42:58 (UTC+8) |
| Abstract: | 電路板產業在台灣已經發展超過40年了，這些年的發展幾乎涵蓋了所有的電子產品的領域，也從2010年以來，台商的海內外產值已經是世界第一，舉凡手機，電腦，伺服器，電信交換機，車用電子；台資的電路板廠早已經是產業下單採購電路板的首選，印刷電路板是一種B to B 的商業模式，消費者並不會注意到在電子產品的內部有幾塊電路板與組裝的零件並執行著產品的相關功能。電路板廠的每一種料號的板子都是具有獨特性的，也都依客戶設計而生產，在工藝上必須考慮製造流程與原物料的選用；在涵蓋電子，機械，化工的製作流程中，在電路板的買家要下單給電路板廠時，價格、品質與交期，永遠是最先考慮的。然而隨著環保意識的抬頭，客戶對於產品性能的苛求；傳統的電子部件採購流程與供應商評選程序容易出現採用挑選過的樣品取得合格供應商資格，但量產後的持續供貨，卻出現信賴度異常與最終消費者因故障退貨，尋求真正失效原因卻是因電路板不良而造成。
近年來愈來愈多的採購者會在電路板供應商評選與採購流程等等供應鏈管理程序裡，透過專業的第三方機構的介入並提供相關的測試以及做為安全規範的把關，可以建立買賣雙方的互信，確保終端產品的壽命與品質。本研究以印刷電路板採購為研究對象範圍，探究第三方機構介入供應商的評選機制與重要性。透過此次的研究與探討，對於目前主要電子相關產業在電路板採購於供應商評選時，將不同產業，不同成品應用與不同的機構所訂定都不盡相同的測試項目；予以歸納分類，也普查電路板行業中，可扮演客觀公正的第三方機構的測試能力與資源，此目的都在確保到終端消費者使用安全與壽命。合適與具備專業權威的第三方機構介入供應鏈管理的效益展現，是電子業供應鏈上中下游的溝通橋樑，讓最初設計的理念可以落實到最終消費者使用的體驗上。研究結論中導出電路板採購程序對於優質第三方機構在專業、公正、客觀與提供一站式的服務，也與產業中的安全規範做比較，訂出後續發展的方向與作法，是此論文研究的具體貢獻。
關鍵字：電路板、供應鏈管理、第三方機構、供應商評選、一站式服務。
The PCB industry has been developed in Taiwan for more than 40 years. It has covered almost all the fields of electronic products recently. Since 2010, the production revenues of Taiwan companies from domestic and oversea factories have been the highest in the world, including mobile phones, computers, and servos. Instruments, telecommunications switches, automotive electronics; Taiwan-funded PCB factory has been the industry`s first choice for purchasing PCB, PCBs follow a B-to-B business model, and the consumer will not notice the electronic that there are several PCBs assembled components inside the product and perform the functions of the product. The PCB of each model is unique and also produced according to the customer`s design. The manufacturing process and the selection of raw materials must be considered, including technologies covering electronics, machinery and chemicals.When the buyer wants to place an order for the circuit board factory, the price, quality and delivery time are always the first consideration. However, with the rise of environmental awareness, customers are demanding product performance; traditional electronic component procurement process, PCB suppliers always select screened good PCB to be qualified as approved venders. Due to lack of representativeness from these samples , the reliability and abnormality are found in the final consumer returning due to the failure, the reason for seeking the root cause of failure is due to the unreliable PCBs.
In recent years, more and more purchasers will need the involvement of 3rd party organizations in the supply chain management procedures such as board supplier selection and procurement processes, through the involvement of professional 3rd -party agencies and provide relevant tests. The safety regulations has been established mutual trust between buyers and sellers to ensure the life and quality of the end products. This study takes PCB procurement as the research object and explores the selection mechanism and importance of 3rd -party agencies involved in suppliers. Through this research and discussion, for the current major electronics-related industries in the PCB procurement supplier selection, different industries, different finished product applications and different institutions set different test items; Also in the survey PCB industry, it can play the testing ability and resources of objective and fair 3rd-party agencies, all of which are aimed at ensuring the safety and longevity of the end consumers. Appropriate and professional 3rd-party agencies involved in the supply chain management benefits, is the communication bridge between the reaches of the supplier chains of electronics industry , so that the original design concept can be implemented to the consumer experience. In the research conclusions, the derived circuit board procurement procedure is a professional, fair, objective and one-stop service for outstanding 3rd-party organizations, and also compares with the safety norms in the industry, and sets out the direction and practice of subsequent development. Specific contributions to electronics industries.
Keywords：Printed Circuit Board (PCB)、SCM ( Supplier Chain Management )、Reliability、3rd Party Agency、One Stop Service |
| Reference: | Birch, B., Chen, W., Bjorndahl, B., Parrish, B., & Carter, R. (2003). PRINTED WIRING BOARD RELIABILITY EVALUATION METHODS. Northrop Grumman Space Technology. .
Chang, S.-M. (2015). Using Thermal Stress Analysis and Taguchi Methods for Design Optimization of Schottky Electronic Packaging.
Chen, Y.-C. (2015). 印刷電路板組裝 (PCBA) 精實生產供備料模式探討-以 Q 公司為研究對象. National Central University.
Cheng, Y.-s. (2014). 印刷電路板產業市場分析與營運績效之研究. National Central University.
Henshall, G., Sweatman, J., Coyle, R., Parker, R., Tisdale, S., Hua, F., . . . Daily, D. (2009). iNEMI lead-free alloy alternatives project report: thermal fatigue experiments and alloy test requirements. Proceedings of the SMTAI, 317-324.
IEK. (2012). 印刷線路板主要供應商現況. Retrieved from www.tpca.org.tw
IPC. (2014). DC Current Induced Thermal Cycling Test. Retrieved from http://www.ipc.org/TM/2-6_2-6-26A.pdf
IPC. (2015). IPC World Production Report Retrieved from www.ipc.org
Jacobs, F. R., Chase, R. B., & Lummus, R. R. (2014). Operations and supply chain management: McGraw-Hill/Irwin New York, NY.
Laboratories, U. (2018). UL iQ for Printed Wiring Board http://iq.ul.com/pwb
Lau, J., Dauksher, W., Smetana, J., & Menis, I. (2003). HDPUG`s design for lead-free solder joint reliability of high-density packages. Paper presented at the IPC SMEMA Council APEX.
Lau, J., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., . . . Sullivan, B. (2003). Reliability testing and data analysis of high-density packages’ lead-free solder joints. Paper presented at the IPC SMEMA Council APEX.
Lee, I. (2016). UL PWB Performance Testing Service Presentation. Paper presented at the JPCA Show, Tokyo.
Pecht, M., & Das, D. (2000). Electronic part life cycle. IEEE Transactions on Components and Packaging Technologies, 23(1), 190-192.
Rahangdale, U., Srinivas, R., Krishnamurthy, S., Rajmane, P., Misrak, A., Sakib, A., . . . Nguyen, L. T. (2017). Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling. Paper presented at the Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017 33rd.
Taiwan, U. (2015). UL 核心服務和產業解決方案
In UL (Ed.).
Team, U. T. P. (2016). 加速 PWB 測試與認證 UL 於 TPCA 展會期間力推多項新服務. TPCA Show 2014.
Tee, T. Y., Ng, H. S., & Zhong, Z. (2003). Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test. Paper presented at the Electronics Packaging Technology, 2003 5th Conference (EPTC 2003).
TPCA. (2008). 2008春季季刊. 電路板雜誌季刊.
Vanderpan, C. (2017). UL Standards for PWBs. Underwriters Laboratories.
Yang, Y., Wang, H., Sangwongwanich, A., & Blaabjerg, F. (2018). Design for reliability of power electronic systems Power Electronics Handbook (Fourth Edition) (pp. 1423-1440): Elsevier.
丁春娥. (2006). 企業願景與顧客關係管理關聯之探討-以銅箔基板 T 公司為例. 元智大學管理研究所學位論文, 1-59.
丁銘飛. (2014). 海峽兩岸印刷電路板產業經營策略比較之研究. 中原大學企業管理研究所學位論文, 1-109.
中央大學管理學院ERP中心. (2012). ERP企業資源規劃導論: 國立中央大學.
太偉. (2013). 讓波音787 更安全. 科技新时代(5), 27-27.
王宗華. (2008). 可靠度工程技術手冊: 中華民國品質學會.
李明旺. (2015). TPCA企業專訪主題系列(13)-下世代PCB市場趨勢與展望. Retrieved from http://www.tpca.org.tw/news_in.aspx?siteid=&ver=&usid=&mnuid=1250&modid=22&mode=&nid=15657&noframe=
周穎傳, & 李榮貴. (2003). " 獨立產品可靠度委測服務實驗室" 現況研究及未來營運模式探討.
林我聰, 羅國正, & 郭建良. (2002). 推行供應鏈管理之不確定性因素及其因應策略之探討-以台灣資訊電子業為例. Journal of the Chinese Institute of Industrial Engineers, 19(6), 60-78.
徐志輝. (2005). 品質資訊系統的規劃—以電路板產業個案公司為例. 元智大學工業工程與管理學系學位論文, 1-83.
陳平. (2018). 扶搖直上，朝氣蓬勃的PCB行業. 海通證券研究報告.
陳銀貴. (2003). 台灣 PCB 產業分析. 拓墣產業研究所.
曾讚憲. (2016). 高可靠度車用印刷電路板之表面處理層開發. 國立中央大學.
童楓. (2017). Prismark 對 2016 年全球剛性覆铜板產銷統計. 覆铜板資訊(3), 20-23.
黃孟槺. (2005). 無鉛焊接之可靠度研究.
楊文廣. (2014). 車用印刷電路板產業分析. 中央大學管理學院高階主管企管碩士班學位論文, 1-117.
熊欣華, 于卓民, & 司徒達賢. (2004). 策略聯盟夥伴之合作信心建立-台灣資訊電子業之實證分析. 管理學報, 21(4), 477-497.
劉名宸. (2017). 三星手機電池爆炸事件對三星及蘋果供應鏈之股價反應分析. 交通大學管理學院管理科學學程學位論文, 1-56.
蔡巧儿. (2010). “國際標準” 舞台上的中國聲音——生益科技主導制定的兩項 IEC 國際標準的啟示. 第十一屆中國覆銅板技術· 市場研討會論文集.
謝銘雲. (2003). 台灣印刷電路板產業的競爭策略. (碩士), 國立台灣大學管理學院.
謝學儀, & 林亭汝. (2007). 產業結構, 策略研究與廠商行為之探討–以台灣印刷電路板產業為例.
龔永林. (2016). 以盈利為驅動力——2015 年世界 PCBfN 造商百强排名. 印制電路信息, 24(9), 5-11. |
| Description: | 碩士
國立政治大學
經營管理碩士學程(EMBA)
105932019 |
| Source URI: | http://thesis.lib.nccu.edu.tw/record/#G0105932019 |
| Data Type: | thesis |
| DOI: | 10.6814/THE.NCCU.EMBA.026.2019.F08 |
| Appears in Collections: | [經營管理碩士學程EMBA] 學位論文
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